Bengaluru: IISc proposes development of world’s smallest semiconductor chip using 2D materials

A team of 30 researchers from the Indian Institute of Science (IISc), Bangalore, has outlined a pioneering project to build the world’s smallest semiconductor chip using cutting-edge two-dimensional (2D) materials. If realized, the innovation could mark a significant leap for India in the global semiconductor industry.

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The proposed chip would use atom-thick 2D materials such as graphene and transition metal dichalcogenides (TMDs). These materials allow for ultra-compact, highly efficient chips that could surpass the capabilities of current silicon-based technology. The chip is expected to measure around one angstrom (0.1 nanometre), significantly smaller than the three-nanometre chips presently used in high-end consumer electronics.

A detailed project report was initially submitted to the Office of the Principal Scientific Adviser (PSA) in 2022 and revised in October 2024. The document has since been shared with the Ministry of Electronics and Information Technology (MeitY), reflecting strong governmental interest. MeitY has reportedly conducted several meetings on the proposal, involving both senior ministry officials and the PSA’s office.

While silicon continues to dominate global chip production, 2D materials are gaining attention for their potential to revolutionize the field. The IISc project, if supported and successfully executed, could position India as a key innovator in next-generation chip technology. The project’s summary is currently accessible via the PSA’s website, signaling transparency and a drive for collaboration in this ambitious national endeavor.